Leaded packages have been in existence since semiconductors were first produced and are characterized by a semiconductor die encapsulated in a plastic mold compound with metal leads surrounding the perimeter of the package. Leadframe packages are the most widely used package type, employed in almost every electronic application.
At JCET, we provide a comprehensive range of leadframe package solutions–from standard leadframe packages to low profile, small and thin, thermally enhanced packages. JCET’s leadframe packages are available in a wide variety of body sizes, lead pitch, and are in standard and green / lead-free bill of materials. Additionally, JCET’s leadframe packages are assembled using industry proven materials and technologies to ensure long term performance and reliability.