JCET offers a high performance fan-out wafer level packaging (FOWLP) solution that provides significant bandwidth, performance, form factor and cost benefits compared to other packaging technologies available today.
As an industry pioneer in FOWLP, JCET has been instrumental in developing fan-out technology into a mature platform that addresses the growing need for higher levels of integration, improved electrical performance and shorter vertical interconnects.
Advantages of FOWLP, also known as embedded Wafer Level Ball Grid Array (eWLB), technology include:• Versatile platform for advanced system level integration
The Most Comprehensive Fan-Out Portfolio in the Industry
An early industry adopter in 2008, JCET set an aggressive course in pushing the boundaries and developing advanced fan-out technology and manufacturing capabilities long before its peers. JCET has driven a number of eWLB technology achievements such as dense vertical interconnections as high as 500 – 1,000 I/O, very fine line and widths spacing down to 2um/2um and ultra thin package profiles below 0.3mm (including solderball) for single packages and below 0.8mm for stacked packages with proven warpage control.
Our comprehensive Fan-out portfolios includes:• A wide range of small die, large die, flip chip, stacked or side-by-side multi-die and ultra-thin options
The compelling performance, size and cost advantages of eWLB are accelerating the adoption of this advanced technology into new markets such as the Internet of Things (IoT) and wearable electronics, Micro-ElectroMechanical Systems (MEMS) and sensors, and automotive applications.
Fan-out eWLB Advantages
eWLB technology provides significant performance, size and cost advantages, compared to other technology available today:
PERFORMANCE• Unprecedented flexibility in 2.5D & 3D integration with silicon partitioning capabilities
FORM FACTOR• Maximum I/O density; 1.5-2X increase in routing density in the smallest, thinnest footprint commercially available today
COST• High volume manufacturing process enables scaling devices to larger carrier sizes for compelling cost reduction