Company Profile

JCET Group is a leading global semiconductor system integration packaging and test provider, offering a full range of turnkey services that include semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to vendors around the world. 

Our comprehensive portfolio covers a wide spectrum of semiconductor applications such as mobile, communication, compute, consumer, automotive and industry etc., through advanced wafer level packaging, 2.5D/3D, System-in-Packaging, and reliable flip chip and wire bonding technologies.   JCET Group has two R&D centers in China and Korea, six manufacturing locations in China, Korea and Singapore, and sales centers around the world, providing close technology collaboration and efficient supply-chain manufacturing to customers in China and around the world.

Milestones

  • December 2019

    JCET Enters Into Strategic Business Agreement with Analog Devices to Grow Singapore Test Business

  • November 2019

    Expansion of JCET D8 (Suqian)

  • July 2019

    New JCET 12 Inch Wafer Bumping Line in Advanced Flip Chip South Korea Factory Ramps into High Volume

  • 2017

    JCET Shanghai Office

  • 2017

    Shanghai Factory Relocated to Jiangyin

  • 2016

    New Korea SiP Factory in Incheon

  • 2015

    JCET Acquired STATS ChipPAC

  • 2014

    SJSEMI Joint Venture with SMIC

  • 2012

    JCET D9 (Chuzhou) Established

  • 2011

    JCET D8 (Suqian) Established

  • 2007

    JCET D3 (Jiangyin) New Factory

  • 2003

    JCAP Established

  • 2003

    JCET IPO on Shanghai Stock Exchange

  • 2000

    Restructured to JCET

  • 1989

    IC Assembly Line

  • 1972

    Jiangyin Transistor Factory Established

  • 2014

    STATS ChipPAC New Korea Factory in Incheon

  • 2013

    Expansion of STATS ChipPAC Singapore Factory

  • 2010

    300/330mm eWLB Manufacturing in Singapore

  • 2009

    Expansion of STATS ChipPAC China Factory

  • 2007

    STATS ChipPAC R&D Center Established in Singapore

  • 2004

    STATS Merged with ChipPAC

  • 2000

    STATS IPO on Singapore & US Stock Exchanges

  • 1994

    ST Assembly Test Services Established

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