Items

Standard

Purpose

Precondition (PRE)

To simulate the effects of changing circumstances including elevated temperatures and moisture during transportation, storage until board assembly. The test should be conducted prior to reliability testing.

Moisture Sensitivity Level(MSL)

To identify the classification level of non-hermetic surface mount devices (SMDs) that are sensitive to moisture-induced stress so that they can be properly packaged, stored, and handled to avoid damage during assembly solder reflow attachment and/or repair operations.

Temperature & Humidity Test
(THT)

GB/T2423.3 
JESD22-A101

To evaluate the ability of product to withstand stress of humidity and temperature for a long time.

Temperature Cycling Test
(TCT)

To evaluate the ability of product to
withstand alternating high- and low-temperature extremes.

High Temperature Storage Test
(HTST)

GB/T 2423.2 
JESD22-A103

To evaluate the ability of product to withstand stress of high temperature for a long time.

Low Temperature Storage Test
(LTST)

To evaluate the ability of product to withstand stress of low temperature for a long time.

Pressure Cooker Test
(PCT)

To evaluate the moisture resistance of package.

Highly Accelerated
Stress Test(u)HAST

To evaluate the moisture resistance of non-hermetic packaged devices under/without bias.

Reflow

To assess thermal resistance and effect produced in reflow soldering process.

BURN-IN 

To access device’s ability of bearing electric stress (voltage and current) and temperature stress (products temperature rise due to loading) for a long time.

High Temperature Reverse Bias  
(HTRB)

To determine the effects of bias conditions and temperature on solid state devices over time.

Soldering Heat Test
(SHT)

To determine whether solid-state devices can withstand the effect of the temperature shock during soldering.

Solderability

To evaluate the solderability of product.