JCET Takes the Top Third Market of Advanced Packaging Technology


According to the Status of Advanced Packaging Industry 2017, issued by the research institution YoleDéveloppement in May 2017, JCET, surpassing ASE Group, Amkor, TSMC and Samsung by 7.8% of the market share of advanced packaging wafer, occupied the third place in worldwide.

According to YoleDéveloppement, the compound annual growth rate (CAGR) of the whole packaging industry is expected to reach 7% during 2016 to 2022, exceeding the total packaging industry (3~4%), semiconductor industry (4~5%), PCB industry (2~3%), global electronic industry (3~4%) and global GDP (2~3%). Fan-out is an advanced packaging platform enjoying the fastest increase with a growth rate of 36%, followed by the 2.5D/3D TSV platform which is growing by a rate of 28%. By 2022, the market size of fan-out packaging is expected to exceed USD 3 billion, while the market size of the 2.5D/3D TSV packaging is forecast to reach USD 1 billion by 2021.

The two-day conference was so informative that the participating representatives reaped tremendous benefits. This conference has set a new record in the number of participants, exhibitors, booths, papers and reports, indicating that a golden time for the development of China’s integrated circuit industry has been around the corner.