275 Middle Binjiang Road, Jiangyin, Jiangsu
Floor Area: 61,369 sqm
GFA: 58,235 sqm
Bumping, Wafer Level Packaging, and Test
Certifications:
ISO9001
IATF16949
ISO14001
ISO45001
ISO22301
SONY GP
ESD20.20
IEC17025
QC080000
ISO 27001
ISO 10012
JCET has six manufacturing sites in China, Singapore and Korea; and two major R&D centers in Korea and China.
We have business branches in over 20 countries or regions, with more than 6,000 engineers worldwide.
Changshan Road, Jiangyin, Jiangsu
Floor Area:374,882 sqm
GFA:372,500 sqm
WLCSP, Bumping, Flip Chip, Leaded
Jiangyin-City East Certificaitons
ISO9001
IATF16949
ISO 14001
ISO 45001
ISO22301
ESD S20.20
QC080000
SONY GP
ISO 17025
ISO/IEC 27001
ISO 10012
JCAP Certificaitons
ISO9001
IATF16949
ISO14001
ISO45001
ISO22301
QC080000
JSCC Certifications
ISO9001
ISO14001
ISO 45001
ISO22301
IATF16949
SONY GP
ESD20.20
QC080000
ISO 17025
No. 5 PuTuoshan Road, Suqian, Jiangsu
Floor Area:307,487 sqm
GFA:124,834 sqm
Power Packaging, IC Packaging, and Test
Certifications
ISO9001
IATF16949
ISO14001
ISO45001
ISO22301
ESD20.20
SONY GP
ISO/IEC 27001
Incheon, South Korea
Floor Area:227,313 sqm
GFA:210,348 sqm
SiP, Bumping, Flip Chip, PoP, MEMs, Wirebond and Test
SCK Certifications
ISO 9001 SCK/JSCK
IATF 16949 SCK/JSCK
ISO 14001 SCK
ISO 14001 JSCK
ISO 45001 SCK
ISO 45001 JSCK
ESD S20.20 SCK/JSCK
Samsung Eco Partner
Sony GP SCK
RBA SCK
78 Changshan Road
Jiangyin, Jiangsu
China
Tel:+86-510-86997519
191 Jayumuyeok-ro Jung-gu
Inchenon 22379
South Korea
Tel: (+32) 340-3114
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