275 Middle Binjiang Road, Jiangyin, Jiangsu

Floor Area: 61,369 sqm

GFA: 58,235 sqm

Bumping, Wafer Level Packaging, and Test

 

Certifications:

ISO9001
IATF16949
ISO14001
ISO45001
ISO22301
SONY GP
ESD20.20
IEC17025
QC080000
ISO 27001
ISO 10012

Changshan Road, Jiangyin, Jiangsu

Floor Area:374,882 sqm

GFA:372,500 sqm

WLCSP, Bumping, Flip Chip, Leaded

 

Jiangyin-City East Certificaitons

ISO9001
IATF16949 
ISO 14001
ISO 45001
ISO22301
ESD S20.20
QC080000
SONY GP
ISO 17025
ISO/IEC 27001
ISO 10012

 

JCAP Certificaitons

ISO9001
IATF16949
ISO14001
ISO45001
ISO22301
ISO/IEC 27001
ESD S20.20
QC080000

 

JSCC Certifications

ISO9001
ISO14001
ISO 45001
ISO22301
IATF16949 
SONY GP 
ESD20.20
QC080000
ISO 17025

No.999 Century Avenue, Chuzhou, Anhui

Floor Area:170,000 sqm

GFA:120,000 sqm

Leaded, Discrete Packaging and Test

 

Certifications:

ISO9001
IATF16949
ISO14001
ISO45001
ISO22301
ESD20.20
SONY GP
ISO/IEC 27001

 

No. 5 PuTuoshan Road, Suqian, Jiangsu

Floor Area:307,487 sqm

GFA:124,834 sqm

Power Packaging, IC Packaging, and Test

 

Certifications

ISO9001
IATF16949
ISO14001
ISO45001
ISO22301
ESD20.20
SONY GP
ISO/IEC 27001

5 Yishun Street 23, 768442, Singapore 

507/509 Yishun Industrial Park A, 768734, Singapore 

Floor Area: 43,390 sqm

GFA: 99,462 sqm

Wafer Level Packaging, eWLB, Wirebond, and Test

 

SCS Certifications

ISO 9001
IATF 16949
ISO 14001
ISO 45001
ISO 27001
ESD20.20
Sony GP
RBA

Incheon, South Korea

Floor Area:227,313 sqm

GFA:210,348 sqm

SiP, Bumping, Flip Chip, PoP, MEMs, Wirebond and Test

 

SCK Certifications

ISO 9001 SCK/JSCK
IATF 16949 SCK/JSCK
ISO 14001 SCK
ISO 14001 JSCK
ISO 45001 SCK
ISO 45001 JSCK
ESD S20.20 SCK/JSCK
Samsung Eco Partner 
Sony GP SCK
RBA SCK

78 Changshan Road

Jiangyin, Jiangsu

China

Tel：+86-510-86997519

191 Jayumuyeok-ro Jung-gu

Inchenon 22379

South Korea

Tel: (+32) 340-3114