Technology & Solutions
Created with Pixso.
Turnkey Services
Design
Packaging
Created with Pixso.
Wirebond Packaging
Created with Pixso.
Flip Chip Packaging
Created with Pixso.
Wafer Bumping
Created with Pixso.
Wafer Level Packaging
Created with Pixso.
System-in-Package
Created with Pixso.
MEMS and Sensors Packaging
Created with Pixso.
Power Device Packaging
Created with Pixso.
Advancement of Mainstream Package
Created with Pixso.
Test
Applications
Created with Pixso.
Automotive
Computing
Storage
Smart Terminals
Power & Energy
About JCET
Created with Pixso.
Company Information
Created with Pixso.
Worldwide Locations
Created with Pixso.
Corporate Culture
Created with Pixso.
Leadership Team
Created with Pixso.
Environmental Social & Governance
Created with Pixso.
Conflict-Free Minerals Policy
Created with Pixso.
Contact Us
Created with Pixso.
Investor Relations
Created with Pixso.
Financial Reports
Created with Pixso.
News
Created with Pixso.
Created with Pixso.
English
中文
Home
Technical Solutions
Created with Pixso.
Turnkey
Design
Packaging
Created with Pixso.
Wirebond Packaging
Flip Chip Packaging
Wafer Bumping
Wafer Level Packaging
System-in-Package
MEMS and Sensors Packaging
Power Device Packaging
Advancement of Mainstream Package
Test
Others
Created with Pixso.
晶圆凸块
可靠性试验与失效分析
Application fields
Created with Pixso.
Automotive
Computing
Storage
Smart Terminals
Power & Energy
About JCET
Created with Pixso.
Company Information
Worldwide Locations
Corporate Culture
Leadership Team
Management Team Environmental, Social & Governance
Contact Us
Investor Relations
Created with Pixso.
Financial Reports
News
Join JCET
Created with Pixso.
Created with Pixso.
English
中文
Homepage
Created with Pixso.
Careers
Careers
