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Technical Solutions
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Turnkey
Design
Packaging
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Wirebond Packaging
Flip Chip Packaging
Wafer Bumping
Wafer Level Packaging
System-in-Package
MEMS and Sensors Packaging
Power Device Packaging
Advancement of Mainstream Package
Test
Others
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晶圆凸块
可靠性试验与失效分析
Application fields
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Automotive
Computing
Storage
Smart Terminals
Power & Energy
About JCET
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Company Information
Worldwide Locations
Corporate Culture
Leadership Team
Management Team Environmental, Social & Governance
Contact Us
Investor Relations
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Financial Reports
News
Join JCET
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