Flip Chip Packaging

Flip Chip packaging, in which the silicon die is directly attached to the substrate using solder bumps instead of wirebonds, provides a dense interconnect with high electrical and thermal performance. Flip Chip interconnection provides the ultimate in miniaturization, reduced package parasitics and enables new paradigms in power and ground distribution to the chip not feasible in other traditional packaging approaches. 

Technical Highlights
Flip Chip Packaging
Covering fcCSP, fcBGA, FCoL, C2W, 3DIC, and other flip-chip formats
Large-size fcBGA packages with multiple thermal-management options
AiP solutions in embedded-antenna SiP or fcBGA formats on laminate substrates
FCoL (Flip Chip-on-Leadframe) solutions using QFN, TSOT, etc., to implement copper-pillar or gold-bump flip-chip packages
Applications
5G Mobile Processors
CPU, GPU & FPGA Processors
Wi-Fi Routers & Power Amplifiers
In-Vehicle Sensors
Infotainment Systems
Wearable Devices
Autonomous Driving
Audio Processors
Communication Infrastructure
More technology