System-in-Package(SiP)

Demands for greater system performance, increased functionality, reduced power consumption, and reduced form factor require an advanced packaging approach known as system integration.

System integration is combining multiple integrated circuits (ICs) and components into a single system or modularized sub-system in order to achieve higher performance, functionality, and processing speeds with a significant reduction in space requirements inside the electronics device.

Technical Highlights
System-in-Package
Package miniaturization via advanced SMT, wire bonding, and flip-chip: minimum component size 008004, 45 µm spacing, ±15 µm placement accuracy.
EMI-shielding options—conformal coatings, partitioned shields, localized overmold—to optimize signal integrity
Dual-sided SiP (pin or pad-based) for reduced footprint, shorter routing, improved signal integrity, plus backside-exposed chips for thinner packages and better thermal performance.
Heterogeneous integration: logic, digital, analog, power management, and memory chips in a single package.
Applications
SSD
High-End Application Processors
PMIC
Connectivity Modules
APU
Front-End Modules
RF MEMS
RF Power Amplifier Modules
Fingerprint Sensors
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