In recent years, the 3D packaging technology has become a dazzling pearl of the semiconductor industry and synonymous with the advanced packaging technology. Chairman Wang began his speech with a brief review of the development and evolution of semiconductor packaging technology to bring on the introduction of 3D TSV packaging technology, which summed up the recent progress of global 3D TSV packaging technology and put forward his own views on the industrial mode changes and restructuring upon the arrival of 3D TSV technology, and concluded with the elaboration on the challenges and opportunities facing Chinese enterprises in the 3D TSV packaging technology, which highlighted the thrust of his speech and had guiding significance for the future development of China’s packaging and testing industry in terms of the 3D TSV technology.