Technology & Solutions
Turnkey Services
Design
Packaging
Wirebond Packaging
Flip Chip Packaging
Wafer Bumping
Wafer Level Packaging
System-in-Package
MEMS and Sensors Packaging
Power Device Packaging
Advancement of Mainstream Package
Test
Applications
Automotive
Computing
Storage
Smart Terminals
Power & Energy
About JCET
Company Information
Worldwide Locations
Corporate Culture
Leadership Team
Environmental Social & Governance
Conflict-Free Minerals Policy
Contact Us
Investor Relations
Financial Reports
News
English
中文
Home
Technical Solutions
Turnkey
Design
Packaging
Wirebond Packaging
Flip Chip Packaging
Wafer Bumping
Wafer Level Packaging
System-in-Package
MEMS and Sensors Packaging
Power Device Packaging
Advancement of Mainstream Package
Test
Others
晶圆凸块
可靠性试验与失效分析
Application fields
Automotive
Computing
Storage
Smart Terminals
Power & Energy
About JCET
Company Information
Worldwide Locations
Corporate Culture
Leadership Team
Management Team Environmental, Social & Governance
Contact Us
Investor Relations
Financial Reports
News
Join JCET
English
中文
Homepage
NEWS
News
NEWS
2021 before
All
2025
2024
2023
2022
2021 before
All
Company News
ESG News
Finance
Company News
2021-12-30
JCET Donates Funds to Support Rural Education Development
Company News
2021-12-17
JCET Unveils New Logo Representing the Company’s Continued Evolution
Company News
2021-11-22
JCET Continues to Expand Its Global Footprint at SEMICON Europa in Germany
Company News
2021-11-19
JCET Expands Production Capacity in Suqian to Better Serve Global Customer Needs
Company News
2021-10-27
JCET Continues Strong 2021 with Another Record High Performance in Q3
Finance
2021-08-20
JCET 1H 2021 Net Profit Jumps 261%, Earnings Surpass FY 2020 Mark
1
2
3
4
5