Technology & Solutions
Turnkey Services
Design
Packaging
Wirebond Packaging
Flip Chip Packaging
Wafer Bumping
Wafer Level Packaging
System-in-Package
MEMS and Sensors Packaging
Power Device Packaging
Advancement of Mainstream Package
Test
Applications
Automotive
Computing
Storage
Smart Terminals
Power & Energy
About JCET
Company Information
Worldwide Locations
Corporate Culture
Leadership Team
Environmental Social & Governance
Conflict-Free Minerals Policy
Contact Us
Investor Relations
Financial Reports
News
English
中文
Home
Technical Solutions
Turnkey
Design
Packaging
Wirebond Packaging
Flip Chip Packaging
Wafer Bumping
Wafer Level Packaging
System-in-Package
MEMS and Sensors Packaging
Power Device Packaging
Advancement of Mainstream Package
Test
Others
晶圆凸块
可靠性试验与失效分析
Application fields
Automotive
Computing
Storage
Smart Terminals
Power & Energy
About JCET
Company Information
Worldwide Locations
Corporate Culture
Leadership Team
Management Team Environmental, Social & Governance
Contact Us
Investor Relations
Financial Reports
News
Join JCET
English
中文
Homepage
NEWS
News
NEWS
All
All
2025
2024
2023
2022
2021 before
All
Company News
ESG News
Finance
Company News
2025-06-06
JCET Recognized as “Most Honored Company” in the Semiconductor Industry and Wins Multiple Annual Awards
Company News
2025-03-28
JCET Group Ranks 29th in Brand Finance Semiconductor 30 2025
Company News
2024-03-29
JCET Packaging Solution for Hall Sensors Strengthens the Safety of New Energy Vehicle
Company News
2024-03-01
JCET Accelerates Construction of Automotive Chip Advanced Packaging Flagship Factory
Company News
2023-12-28
Share, Trust, and Prosper: JCET Hosts the 2023 Global Supplier Day
Company News
2023-12-27
Immersive Semiconductor Packaging and Test Museum Opens in Jiangyin
1
2
3
4
5