Technology & Solutions
Turnkey Services
Design
Packaging
Wirebond Packaging
Flip Chip Packaging
Wafer Bumping
Wafer Level Packaging
System-in-Package
MEMS and Sensors Packaging
Power Device Packaging
Advancement of Mainstream Package
Test
Applications
Automotive
Computing
Storage
Smart Terminals
Power & Energy
About JCET
Company Information
Worldwide Locations
Corporate Culture
Leadership Team
Environmental Social & Governance
Conflict-Free Minerals Policy
Contact Us
Investor Relations
Financial Reports
News
English
中文
Home
Technical Solutions
Turnkey
Design
Packaging
Wirebond Packaging
Flip Chip Packaging
Wafer Bumping
Wafer Level Packaging
System-in-Package
MEMS and Sensors Packaging
Power Device Packaging
Advancement of Mainstream Package
Test
Others
晶圆凸块
可靠性试验与失效分析
Application fields
Automotive
Computing
Storage
Smart Terminals
Power & Energy
About JCET
Company Information
Worldwide Locations
Corporate Culture
Leadership Team
Management Team Environmental, Social & Governance
Contact Us
Investor Relations
Financial Reports
News
Join JCET
English
中文
Homepage
NEWS
News
NEWS
All
All
2025
2024
2023
2022
2021 before
All
Company News
ESG News
Finance
Company News
2017-08-31
Secretary of the CPC Jiangsu Provincial Committee Li Qiang and His Panel Visit Changjiang Elec. Tech. (Suqian)
Company News
2017-08-31
Former President of the Export-Import Bank of China Li Ruogu and His Panel Pay a Survey Visit to JCET
Company News
2017-08-31
Leaders of General Administration of Customs, P.R. China Pay a Visit to JCET
Company News
2017-08-31
ViceGovernor of People’s Government of Jiangsu Province Ma Qiulin and His Panel Pay a Visit to JCET
Company News
2017-03-27
Monthly Shipment of WLCSP from JCAP exceeds 600 Million
Company News
2017-03-27
Good news from STATS ChipPAC: the eWLB expansion project is up to standard and industrial production realized, and the factor
14
15
16
17
18