Technology & Solutions
Turnkey Services
Design
Packaging
Wirebond Packaging
Flip Chip Packaging
Wafer Bumping
Wafer Level Packaging
System-in-Package
MEMS and Sensors Packaging
Power Device Packaging
Advancement of Mainstream Package
Test
Applications
Automotive
Computing
Storage
Smart Terminals
Power & Energy
About JCET
Company Information
Worldwide Locations
Corporate Culture
Leadership Team
Environmental Social & Governance
Conflict-Free Minerals Policy
Contact Us
Investor Relations
Financial Reports
News
English
中文
Home
Technical Solutions
Turnkey
Design
Packaging
Wirebond Packaging
Flip Chip Packaging
Wafer Bumping
Wafer Level Packaging
System-in-Package
MEMS and Sensors Packaging
Power Device Packaging
Advancement of Mainstream Package
Test
Others
晶圆凸块
可靠性试验与失效分析
Application fields
Automotive
Computing
Storage
Smart Terminals
Power & Energy
About JCET
Company Information
Worldwide Locations
Corporate Culture
Leadership Team
Management Team Environmental, Social & Governance
Contact Us
Investor Relations
Financial Reports
News
Join JCET
English
中文
Homepage
NEWS
News
NEWS
All
All
2025
2024
2023
2022
2021 before
All
Company News
ESG News
Finance
Company News
2013-05-10
JCET successfully participated in the Semi China 2013
Company News
2013-05-10
Successful holding of the 1st “Voice of JCET”
Company News
2012-12-08
Jiangyin Xinchao Technology Group Co., Ltd. gained the honor of “One of Top 10 Semiconductor Enterprises in China”
Company News
2012-12-08
The first New Technology Promotion Conference of Changjiang Electronics Technology was successfully held in North America.
Company News
2012-12-08
The completion and opening ceremony of the Changjiang Electronics Technology (Chuzhou) Co., Ltd., namely 10 key projects, was
Company News
2012-12-08
Dr. Dongkai Shangguan et al came to Jiangyin Changdian Advanced Packaging Co., Ltd. for an exchange visit
17
18
19
20
21