长电科技-文档库

文档库

FLIP CHIP INTERCONNECT

Fine Pitch Cu Pillar Assembly Challenges for Advanced Flip Chip Packages [2017] Download

Fine Pitch High Bandwidth Flip Chip Package-on-Package Development [2017] Download

Fine Pitch Cu Pillar with BOL Assembly Challenges for Low Cost and High Performance Flip Chip Package [2017] Download

Large Flip Chip Assembly Challenges and Risk Mitigation Process [2017] Download

10nm CPI Study for Fine Pitch Flip Chip Attach Process and Substrate [2017] Download

Advanced Packaging for Automotive Dashboard Application [2017] Download

Ultra-Thin Substrate Assembly Challenges for Advanced Flip Chip Package [2016] Download

Thin Profile Flip Chip Package-on-Package Development [2016] Download

Fine Pitch Cu Pillar with BOL Assembly Challenges for High Performance Flip Chip Package [2016] Download

Advanced Flip Chip Package on Package [2016] Download

Design and Stress Analysis for Fine Pitch Flip Chip Packages with Cu Column Interconnects [2014] Download

Optimization of Compression Bonding Processing Temp for Fine Pitch Cu Col Flip Chip Devices [2014] Download

Electromigration for Advanced Cu Interconnect and the Challenges with Reduced Pitch Bumps [2014] Download

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